The semiconductor manufacturing industry in data centers can benefit from adopting the high-quality standards set by the automotive industry. Automotive Original Equipment Manufacturers (OEMs) have established an ambitious goal of 10 defective parts per billion (DPPB) for their semiconductor suppliers, a benchmark that data center system-on-chips (SoCs) aim to achieve. The automotive industry and data center chipmakers may seem like disparate domains, but the pursuit of quality and reliability unites them. This article delves into the collaborative efforts of Nidec Corp., Renesas, and other industry leaders to develop advanced semiconductor solutions for the next-generation E-axle in electric vehicles (EVs). It also explores the valuable lessons data center chipmakers can learn from the automotive industry’s approach to achieving zero defects and maintaining high-quality standards.
Integration for EV Advancements
Nidec Corp. and Renesas have embarked on a strategic collaboration to meet the evolving demands of EV technology. Their goal is to integrate traction motor and power electronics within the next-generation E-axle, known as the X-in-1 system. By incorporating power electronic controls like DC-DC converters and onboard chargers (OBCs), they aim to enhance performance, efficiency, size, weight, and cost in electric vehicles. However, the integration of multiple functions in the X-in-1 system brings about complexity and challenges in ensuring superior vehicle quality.
Ensuring Safety and Quality
To address safety concerns, preventive safety technologies such as diagnostic functions and fault prediction play a pivotal role in upholding the highest quality standards in electric vehicles. The collaborative efforts between Nidec Corp., Renesas, and other industry leaders are dedicated to developing these technologies and maintaining the integrity of the X-in-1 system. By leveraging their expertise, they strive to overcome the challenges associated with complexity and maintain superior vehicle quality.
Proof-of-Concept Development
Scheduled for release by the end of 2023, the initial proof-of-concept (PoC) will feature a comprehensive 6-in-1 system, including a DC-DC converter, OBC, power distribution unit (PDU), motor, inverter, and gearbox. This PoC represents a significant step towards the integration of various components in the X-in-1 system. Moving forward, Nidec Corp. and Renesas plan to develop an even more integrated X-in-1 PoC in 2024, incorporating additional components like a battery management system (BMS). The adoption of SiC (silicon carbide) technology in the first PoC and GaN (gallium nitride) technology in the second PoC highlights their commitment to enhancing efficiency and reducing size and cost.
Lessons from Automotive for Data Center Chipmakers
The automotive industry’s focus on achieving zero defects and maintaining high-quality standards offers valuable insights for data center chipmakers. Automotive Original Equipment Manufacturers (OEMs) have set a benchmark of 10 defective parts per billion (DPPB) for their semiconductor suppliers. Similarly, data center system-on-chips (SoCs) aspire to reach this level of quality. By adopting automotive techniques, such as extensive screening, longer design cycles, and zero defect tools semiconductors, data center chipmakers can ensure power, performance, and reliability goals are met.
Overcoming Challenges in Chip Manufacturing
Data center chipmakers face the challenge of producing chips rapidly while meeting power and performance targets. The complexity of data center CPUs, GPUs, and AI processors, coupled with tight design margins, can lead to errors. Advanced inspection techniques, including optical wafer inspection and e-beam metrology, aid in identifying defects and achieving higher product quality. Optimizing testing processes, employing Automatic Test Pattern Generation (ATPG) tools, and implementing outlier detection algorithms contribute to early life reliability and improved chip quality.
Towards a Shared Vision
The convergence of automotive and data center chip manufacturing can revolutionize semiconductor solutions and drive advancements in electric vehicle technology. By harnessing the synergies between Nidec Corp., Renesas, and other industry leaders, these collaborative efforts push the boundaries of innovation, fostering a safer and more efficient mobility ecosystem. Data center chipmakers can learn from the automotive industry’s pursuit of zero defects, implementing advanced inspection techniques, optimizing testing processes, and embracing outlier cluster detection semiconductor algorithms to achieve higher product quality and enhanced customer satisfaction.
Conclusion
The strategic collaboration between Nidec Corp., Renesas, and other industry leaders represents a convergence of automotive and data center chip manufacturing. As they develop advanced semiconductor solutions for the next-generation E-axle in electric vehicles, valuable lessons emerge for data center chipmakers. By adopting the automotive industry’s approach to achieving zero defects and maintaining high-quality standards, data center chipmakers can drive advancements in chip manufacturing practices, ensuring higher product quality, improved reliability, and customer satisfaction in the data center sector.
References:
- Chien, T. (2019). From Automotive to AI Chips: The Road to Zero Defects. Semiconductor Engineering.
- Talbot, R. (2021). Zero Defects, Six Sigma, and Quality in the Automotive Industry. SixSigma.com.
- He, G., et al. (2020). Towards an automotive reliability and quality target of 10 DPPB (defective parts per billion). IEEE Transactions on Device and Materials Reliability, 20(4), 503-512. DOI: 10.1109/TDMR.2020.3031543
- https://www.eenewseurope.com/en/nidec-renesas-collaborate-on-semiconductors-for-e-drives/
- https://www.eenewseurope.com/en/samsung-offers-automotive-mlccs-with-worlds-largest-capacitance/
